IEEE transactions on components and packaging technologies (Print)

Other titles
Transactions on components and packaging technologies; Components and packaging technologies; Institute of Electrical and Electronics Engineers transactions on components and packaging technologies
Corp./Body Author
Institute of Electrical and Electronics Engineers Components, Packaging & Manufacturing Technology Society
Publisher
Institute of Electrical and Electronics Engineers
Place of publication
New York, NY
From year - To year
1999-2010
Type of resource
Periodical
Frequency
Quarterly
Language
English
Country of publication
United States
ISSN
1521-3331
ISSN-L
1521-3331
Codice Dewey code
621.317
Journal code
P 00202404
Database
acnp
Medium
Printed text
Acnp cumulative hol.
1999-2010.
Annate con indici
Libraries